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International Journal of Innovation and Applied Studies
ISSN: 2028-9324     CODEN: IJIABO     OCLC Number: 828807274     ZDB-ID: 2703985-7
 
 
Saturday 26 May 2018

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  Call for Papers - May 2018     |     Now IJIAS is indexed in EBSCO, ResearchGate, ProQuest, Chemical Abstracts Service, Index Copernicus, IET Inspec Direct, Ulrichs Web, Google Scholar, CAS Abstracts, J-Gate, UDL Library, CiteSeerX, WorldCat, Scirus, Research Bible and getCited, etc.  
 
 
 

Modeling of the lock-in thermography process through finite element method for measuring of the thermal diffusivity


Volume 5, Issue 4, April 2014, Pages 354–359

 Modeling of the lock-in thermography process through finite element method for measuring of the thermal diffusivity

Ahmed Elhassnaoui1, Abderrahim Saifi2, Asseya Elamiri3, and Smail Sahnoun4

1 Laboratory of Electronics, Instrumentation and Signal Processing, Department of Physics, Faculty of Science, Chouaib Doukkali University BP 20, 24000, El Jadida, Morocco
2 Laboratory of Electronics, Instrumentation and Signal Processing, Department of Physics, Faculty of Science, Chouaib Doukkali University BP 20, 24000, El Jadida, Morocco
3 Laboratory of Electronics, Instrumentation and Signal Processing, Department of Physics, Faculty of Science, Chouaib Doukkali University BP 20, 24000, El Jadida, Morocco
4 Laboratory of Electronics, Instrumentation and Signal Processing, Department of Physics, Faculty of Science, Chouaib Doukkali University BP 20, 24000, El Jadida, Morocco

Original language: English

Received 8 March 2014

Copyright © 2014 ISSR Journals. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract


In industry, especially in the high technology sector such as aerospace, we produce and we use increasingly new materials for the construction of new structures that have good thermal and mechanical properties. The characterization of these materials requires knowledge of their thermo-physical properties. Thermal diffusivity is an important parameter in the materials characterization. Lock-in thermography is widely used in the materials thermal characterization. It involves applying on the front face sample a heater in the form of a sine wave and analyzing the phase difference or the amplitude difference between the incident thermal wave and the transmitted thermal wave. Indeed, the passage of the thermal wave through a material is influenced by its thermal diffusivity. We used the finite element method, in three dimensions, to calculate the instantaneous temperatures of the front and rear faces of the inspected sample, and deduct their phase shifts and therefore the sample thermal diffusivity. Our contribution in the lock-in thermography technique is the development of a new model for the thermal diffusivity evaluation with good precision. The results for polystyrene are very satisfactory. Indeed, the thermal diffusivity calculated by our new model is very close to the value reported in the literature. The proposed new model can be used in the characterization of new materials.

Author Keywords: Lock-in thermography, Finite element method, Thermal diffusivity, Modeling, Simulation.


How to Cite this Article


Ahmed Elhassnaoui, Abderrahim Saifi, Asseya Elamiri, and Smail Sahnoun, “Modeling of the lock-in thermography process through finite element method for measuring of the thermal diffusivity,” International Journal of Innovation and Applied Studies, vol. 5, no. 4, pp. 354–359, April 2014.